'Clever pipework takes the heat out of frying chips'
(Article Precis, 01/Aug/1998, Issue 2145, p16)
Jeff Hecht reports that a research team at Sandia national
Labs has developed a chip with a cooling mechanism that is a
fundamental part of the chip substrate.
As the heat generated by chips increases towards many tens of watts,
researchers are looking for better ways to keep chips cool. This new
technique uses existing manufacturing methods to create tiny tubes,
filled with a light solvent, mere nanometres across in the base of
the chip. A natural heating action makes the liquid within the tubes
transfer heat away from the chip's core, offering better cooling
efficiencies compared to traditional plated metal structures.
Note: In order to comply with copyright law, I have ommited some
details from the original article. Thus, for a complete insight into
the topic covered here, please either consult your local library for
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newsagent, or back-order it from the publishers.
Precised by Ian Mapleson, 16/Aug/1998.